Product name: CM-I2009
Substrate: 12 golden polyimide
Substrate thickness (um): 12
Adhesive: silicone pressure sensitive adhesive
Substrate: 50 transparent teflon release film
High temperature resistant(℃): >260
Loop tack (Kgf/25mm²): 0.9±0.2
Adhesion on stainless steel (Kgf/25mm): 0.35-0.5
Holding power (H): >24
To use the 12um golden polyimide film which was coating with silocone pressure sensitive adhesive, then the product will have good fit, insulation preperties and high temperatue resistance. This production is specially designed for circuit boards protective.
Basic product specification
High heat resistance, after 260℃ in 30min without residual glue;
Excellent adhesion power within 350-500g
Excellent insulation;
Illustration on the application of Cheermo’s products in mobile phone parts and auxiliary die cutting materials