Product name:CM-I3007
Substrate: Black coatd on gold PI
Substrate thickness (um): 12~18
Adhesive:Thin thickness, high peel adhesion
Base substrate: transparent release type
Heat resistance (℃): >230
Voltage resistance (KV): >3
Insulation impedance (MΩ): >40
Loop initial force (Kgf/25mm²): 1.0±0.3
Stainless steel adhesion (peeling force) (Kgf/25mm): >1.0
Holding force (H): >24
In response to current high requirements for heat-resistant materials in the electronic and electrical industry and circuit board manufacturing industry, Cheermo will introduce an ultra-thin, heat-resistant and high adhesion insulating black matte PI label, subject to high-temperature surface reinforcement protection, Metal baking finish by spray painting with high temp, surface painting protection on sandblasting, and after high-temperature paint baking. This product can be easily stripped, without residual adhesive. It is made by black matte insulation of 12# golden PI, and application of thin high adhesion imported adhesive on the back, with a thickness of less than 0.035mm.
Total thickness < 0.035mm
Heat resistance
>230 °C
High tensile strength
Excellent chemical
resistance and no residues
Halogen-free, compliant with ROHS and other environmental protection requirements for electronics;
Voltage resistance > 3KV
Insulation resistance >40MΩ
Application
Illustration on the application of Cheermo’s products in mobile phone parts and auxiliary die cutting materials